Designing Oxide Fillers for Advanced Thermal Interface Materials: Recent Progress and Future Perspectives

Oxide fillers for thermal interface materials (TIMs) have recently gained attention as reliable heat‐management solutions in advanced electronic packaging. Oxide fillers exhibit balanced performance, with moderate intrinsic thermal conductivity, excellent electrical insulation, processing compatibility, and cost competitiveness, thereby providing unique advantages over other filler systems. This review systematically summarizes the recent progress in oxide‐based TIMs, with particular emphasis on how the intrinsic properties and structural design govern the heat transfer performance. Strategies such as tailoring the filler morphology, hybrid filler combinations, surface and interfacial modifications, and the construction of three‐dimensional networks are comprehensively discussed as effective approaches to enhance heat‐transfer efficiency. Furthermore, the challenges associated with oxide fillers in TIM applications and prospective research directions are highlighted, offering valuable insights into the future development of next‐generation electronic packaging and thermal‐management technologies.