材料科学
复合材料
环氧树脂
热导率
电介质
复合数
保温
电导率
介电强度
图层(电子)
化学
光电子学
物理化学
作者
Wenxia Sima,Wenlong Pang,Potao Sun,Tao Yuan,Ming Yang,Zhaoping Li,Hefei Wang
标识
DOI:10.1016/j.ceramint.2023.03.116
摘要
Epoxy-based composites with high insulation and thermal conductivity are desirable materials for electronic and electrical applications. However, resolving the tradeoff between insulation and thermal conductivity remains challenging. Based on the functional requirement, we designed and fabricated a cactus-like double-oriented epoxy composite by combining magnetic orientation and ice-templated methods. Semiconducting SiC endowed the composite with field-grading characteristics, thus relieving local electric field stress along the horizontal direction, while BN with high thermal conductivity promoted heat dissipation along the vertical direction. The composite exhibited its highest performance with 15 vol% filler, improving the breakdown voltage and thermal conductivity by 43.7% and 1312% compared with pure epoxy, respectively, outperforming recently developed packaging materials. It is believed that this work offers an efficient strategy for the fabrication of the filler structure and provides insights on the simultaneous enhancement in insulation and thermal conductivity of polymer composites.
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