TSMC in the Silicon Photonics Era - an electrical perspective

TSMC is actively pursuing a Photonics Foundry Service to meet increased customer requests. The COUPE 3D packaging technology is a key part of this strategy since it enables a Photonics Die to be co-packaged with an Electric Die greatly reducing the interconnect signal integrity penalty between the two dice. This paper will present some of the work-in-progress to enable this breakthrough technology and highlight some aspects of the interconnect benefits between the two dice.