Thick copper core and high resin content pressing structure study

This article is based upon a typical multilayer press experiment of an inline PCB production,which is with thick copper inner board and high resin content lamination structure.It particular introduced the influence of different lamination equipment,lamination process and different lamination structure for this special structure.And finally base on the analysis of actual experiment,it raised some proposal which is more suitable for the lamination of the special structure,provided good guidance significance to improve the problem such as pressing drape,bad uniformity of board thickness,and etc.