材料科学
动态再结晶
高温合金
粒度
微观结构
等温过程
应变率
流动应力
锻造
冶金
再结晶(地质)
复合材料
变形(气象学)
齐纳钉扎
热加工
热力学
凝聚态物理
临界电流
钉扎力
古生物学
物理
生物
超导电性
作者
T. Hara,Toshiki Ishida,Katsunari Oikawa
标识
DOI:10.2320/matertrans.mt-mbw2019002
摘要
The high temperature deformation and microstructure evolution of Ni–Co base superalloy TMW-4M3 during the isothermal forging process were studied. A uniform compression test of TMW-4M3 where both the strain rate and compression temperature were controlled showed dynamic recrystallization flow stress. The peak stress and steady stress of the deformation resistance curve were characterized with the Zener-Hollomon parameter. The average grain size after dynamic recrystallization was also correlated with the Zener-Hollomon parameter, but this relationship changed with compression temperature. We found that this temperature dependency was related to the pinning effect of the γ′ precipitates in the γ matrix and proposed a new prediction model for dynamic recrystallization grain size considering not only the Zener-Hollomon parameter but also the volume fraction of the γ′ precipitates. This enables us to calculate the average grain size after isothermal forging within an error of 12%.
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