Surfactant-stabilized copper paticles for low-temperature sintering: Paste preparation using a milling with small zirconia beads: Effect of pre-treatment with the disperse medium

Copper paste is considered as a promising candidate for printed electronics in replacement for silver paste. This is owing to copper which has anti-electromigration property, lower cost, and similar conductivity and compared with silver. We synthesize a copper nanoparticle (NP) paste that can be sintered at low temperature for high conductivity. The copper NP paste composes of 50 wt% copper NPs and dipropylene glycol (DPG) as the disperse medium. The effect of DPG coating and various conditions of milling with small beads on improving the dispersity of copper NPs has been investigated. The optimum conditions for milling are at 1000 and 2000 rpm for 30 min. This results in a volume resistivity of 6.62 × 10-6 Ω·cm after sintering the copper NP paste at 200 °C.