Resistive loading implemented by direct-write fabrication

In this paper, results are presented for resistive loads constructed by direct-write fabrication on rigid microwave substrates. The key innovation in this work is the implementation of distributed resistive loading by direct-write fabrication at microwave/RF frequencies, as opposed to using discrete surface mount chip resistors. The goal of this research is to extend the range of devices that can be constructed by direct-write fabrication at these frequencies on non-ceramic substrates.