Selection of quaternary ammonium groups for optimizing properties of water‐soluble, photosensitive phenolic resins and study of their postcuring mechanism

Abstract This article deals with the selection of quaternary ammonium groups for synthesis of water‐soluble, photosensitive phenolic resins, containing acrylate and different quaternary ammonium salt groups (AQSPRs), via ring‐opening reactions of epoxy phenolic resin (EPR) with acrylic acid and with different tertiary amine‐protonic acid salts. Conversion of epoxy groups, solubility, photosensitive properties, and thermal decomposition of the different AQSPRs were compared. Modification of AQSPR with methanol solution of KOH to form phenolic resin containing both quaternary ammonium hydroxide groups and acrylate groups (AQHPR) was also studied. Characterization by IR spectrum, DSC, and thermal gravimetric analysis was carried out. The results showed that in the synthesis of AQSPRs containing different quaternary ammonium salt groups, the efficiency of ring‐opening reaction of epoxy phenolic resin with tertiary amine salt in terms of conversion of epoxy groups decreases in the following order: for the tertiary amine, N,N‐dimethyl benzylamine (DMBA) > triethylamine (TEA) > trimethylamine (TMA) > N,N‐dimethyl aniline (DMA) > triethanolamine (TENA) > tri(n‐butylamine) (TBA); for the protonic acid, HCl > HBr > HCOOH > HI > NaHSO3 > Cl3CCOOH > HClO4 > HBF4. All the AQSPRs except that from HClO4 can be dissolved in water, methanol, DMF, or DMSO. The gel content formed during UV exposure decreases in the following order of acids used in forming quaternary ammonium salt groups: HCl > HCOOH > NaHSO3 > Cl3CCOOH; or decreases in the following order of tertiary amines or hydrohalic acids used in forming the quaternary ammonium groups: TMA. > TEA > DBMA; HCl > HBr > HI. During thermal decomposition of EPR with about half epoxy groups of EPR ring‐opened with tertiary amine salt at 160°C for 0.5 h, water‐insoluble product was formed. The insoluble content and the % decrease of epoxy groups or halide ions increase in the following order: TMA < TEA < DMBA; HCl < HBr < HI. The % decrease of epoxy groups for the insoluble residue is nearly equal to the % decrease of halide ions. A crosslinking reaction mechanism occurred in the thermal decomposition was thus proposed. During the modification of AQSPR with KOH, conversion of quaternary ammonium chloride groups can reach above 90%. The decomposition temperature of the quaternary ammonium groups was lowered from 204 to 120°C after modification of AQSPR with KOH. The photosensitive properties of the resin after modification became lower. It is better to react DMBA · HCl with EPR so as to obtain a product with higher conversion of epoxy groups, good water solubility, moderate photosensitivity, lower decomposition temperature, and better postcuring. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 91: 2914–2922, 2004