材料科学
铜
冶金
溶解
腐蚀
极化(电化学)
点蚀
电化学
亚稳态
扫描电子显微镜
铜水管的冲蚀腐蚀
固溶体
X射线光电子能谱
微观结构
渗透(战争)
作者
Sucheng Chen,Keping Wang,Wurong Wang,Jingguang Peng,Liya Guo
标识
DOI:10.1016/j.corcom.2026.01.001
摘要
• Corrosion behaviour of 304Cu was studied with a focus on inclusions and passive films. • Only MnS dissolved during metastable pitting. • Copper dissolution could promote pit formation. Copper (Cu) is often added into stainless steel to enhance their antimicrobial properties, though the effects of Cu on its corrosion resistance remain unclear. To investigate the influence of Cu on pitting behavior of stainless steel 304, a comprehensive study was conducted with electrochemical techniques, scanning electron microscopy, and X-ray photoelectron spectroscopy. Potentiostatic polarization measurements reveal that the addition of Cu affected the preferential dissolution of inclusions during both metastable and stable pitting. Additionally, Cu addition alters the composition and thickness of passive film, and thereby influenced corrosion behavior of stainless steel 304.
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