Fabricating Metallic Circuit Patterns on Polymer Substrates through Laser and Selective Metallization

was the key factor to achieve the successful selective metallization. SEM revealed that after the electroless plating, the copper layer actually physically anchored into the polymer substrate, giving an excellent mechanical adhesion property of the obtained metallic patterns. In addition, the micro-Raman surface imaging approved the generation of the amorphous carbon on the polymer composites' surface after NIR laser irradiation, and the chemical reaction region caused by the pulsed laser spot was found at approximately 40 μm. This environmentally friendly and effective strategy for fabricating circuit patterns on the polymer surface has a possible application in the printed circuit plate (PCB) industry.