材料科学
复合材料
硅橡胶
玻璃微球
热分解
热导率
极限抗拉强度
微球
保温
锂(药物)
化学工程
化学
医学
工程类
内分泌学
图层(电子)
有机化学
作者
Chuanao Cheng,Chongguang Zang,Yijun Chen
出处
期刊:Journal of physics
[IOP Publishing]
日期:2023-04-01
卷期号:2468 (1): 012118-012118
标识
DOI:10.1088/1742-6596/2468/1/012118
摘要
Abstract In this paper, the high-efficiency thermal insulation composites were prepared and investigated, which are formed by the addition of hollow SiO 2 microspheres, hollow glass microspheres, and hollow phenolic microspheres into addition-type liquid silicone rubber. The thermal conductivity of composites is as low as 0.054 W/(m·K), which is 70.65% lower than the matrix (the thermal conductivity of the matrix is 0.184 W/(m·K)), and the tensile strength is 1.003 Mpa, and the thermal decomposition temperature of the composites is 427 °C .
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