材料科学
形状记忆聚合物
3D打印
聚合物
纳米技术
空格(标点符号)
工程物理
复合材料
计算机科学
工程类
操作系统
作者
VIJAY KASHIMATT M. G,Sumodh Kumar,Mrityunjay Doddamani
标识
DOI:10.1002/adem.202401427
摘要
Developing thermoplastic polyimide (TPI), capable of handling space conditions, through 4D printing is challenging due to its high melting temperature and inherent viscosity. This study presents 4D printing of TPI for shape memory investigation under repetitive cycles for the first time, exploring its potential for self‐deployable hinges in space devices. 4D‐printed TPI exhibits outstanding shape memory effect (SME) with shape fixity ( R f ) up to 100% and shape recovery ( R r ) of 100% in first cycle. R f is noted to be increasing up to third cycle and then fixed to 100% up to tenth cycle, while R r shows a decreasing trend in subsequent cycle with a drop of 37% in tenth cycle. Moreover, it exhibits extremely high glass‐transition temperature, T g = 263.10 °C, degradation temperature, T d = 520 °C, and storage modulus of 1600 MPa. Among existing high‐performance (HP) and conventional shape memory polymers (SMPs), 3D‐printed TPI exhibits superior performance. T g of the TPI is found to be 66.52%, 107.16%, and 62.41%, higher than existing HP‐SMPs, polyether ether ketone ( T g = 158 °C), polyamide ( T g = 127 °C), and polyether ketone ketone ( T g = 162 °C), respectively. This investigation reveals a novel characteristic, the SME, of 4D‐printed TPI with ultra‐high T g and T d , demonstrating suitability for self‐deployable hinges, contributing to materials engineering and 4D printing.
科研通智能强力驱动
Strongly Powered by AbleSci AI