Application of Micromachining Technology to Lateral Field Emission Devices

We demonstrate a range of novel applications of micromachining and microelectromechanical systems (MEMS) in achieving efficient and tunable field emission devices (FEDs), and in improving their ease of integration. In each case, arrays of lateral field emission tips are fabricated with submicron spacing utilizing deep reactive ion etch (DRIE). Tip density of over 150-10 6 tips/cm 2 can be achieved, and current of over 150 A/cm 2 By utilizing sacrificial sidewall spacing, electrodes can be placed at arbitrarily close distances. We further utilize MEMS actuators to laterally adjust electrode distances. To improve integration capability of the FEDs, we demonstrate batch bump transfer integration of working FEDs onto a quartz target substrate.