半导体器件制造
工程类
工程物理
制造工程
电气工程
薄脆饼
摘要
Fully updated, state-of-the-art semiconductor design and manufacturing informationThis fully updated handbook provides cutting-edge technologies and state-of-the-art processes needed to design and fabricate IC chips, MEMS, sensors, and other electronic devices. The book lays out the electronics fundamentals and techniques that are required to understand and accelerate the pace of innovation.Semiconductor Manufacturing Handbook, Second Edition consolidates many complex engineering and manufacturing disciplines into one volume, enabling the quick look up of specific reference data. Readers will get complete details on semiconductor fundamentals and basic materials, front-end of line processes, back-end of line processes, nanotechnology, MEMS, photovoltaics, gases and chemicals, and fab yield, operations and facilities.Covers the breadth and width of emerging technologies and manufacturing processes that enable big data, the Internet of Things, and smart manufacturingFully explains global regulations and environmental requirementsWritten by 50 international experts and reviewed by a seasoned advisory board
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