Reaction Diffusion in the Cu-Ti System

Reaction diffusion between pure Cu and Ti has been studied in the temperature range from 963 to 1143 K. Formation of six intermetallic compounds, Cu4Ti, Cu2Ti, Cu3Ti2, Cu4Ti3, CuTi and CuTi2, has been observed in the diffusion zone, as predicted by the equilibrium phase diagram of the Cu-Ti system.The layer thickness of these intermetallic compounds except Cu4Ti has been found out to obey the parabolic law, showing that the growth of the phase layer has been controlled by diffusion process. Above 1083 K the growth of the Cu3Ti2 phase has been observed after an incubation time.The temperature dependence of the growth rate constants of Cu4Ti3, CuTi and CuTi2 phase layers has satisfied the Arrhenius relationships.