热导率
材料科学
复合材料
碳化硅
环氧树脂
热流密度
热传导
有限元法
热阻
热的
传热
结构工程
物理
气象学
工程类
热力学
作者
Zhengrong Zhou,Rongjin Huang,T Wang,Shaoxiong Xie,Yang Zhao,Shuang Wu,Wanyin Zhao,Zhuolin Wu,H M Liu,L F Li
出处
期刊:IOP conference series
[IOP Publishing]
日期:2022-05-01
卷期号:1241 (1): 012015-012015
标识
DOI:10.1088/1757-899x/1241/1/012015
摘要
Abstract Polymer-matrix composites play an important role as packaging material in superconducting equipment. The research on thermal conductivity of composites by combining computer numerical simulation and reference data can not only save the expenses but also shorten the period of material development. Herein, the internal heat flow of silicon carbide/aluminum nitride/Epoxy composites was simulated by COMSOL finite element software. And the thermal conductivity calculated by the finite element software is compared with the existing thermal conductivity mechanism. Meanwhile, the influence of the fraction, gap distance, interfacial thermal resistance, etc. on the thermal conductivity of composites was analyzed. In short, it can provide a reference for the thermal conductivity design of polymer composites.
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