3D integration technologies for custom SiPM: From BSI to TSV interconnections

Progress in 3D interconnecting technologies paved the way for a new generation of Silicon Photomultipliers (SiPM) and Single Photon Avalanche Diode (SPAD): hybrid devices which combine the integrated functionalities of the digital SiPM with the high performance of custom technologies, like low noise and high detection efficiency. Recently, Fondazione Bruno Kessler (FBK) has been working on the implementation of recently developed 3D integration technologies, on SiPMs devices, to improve both performances and functionalities by creating backside-illuminated (BSI) devices and Through Silicon Vias (TSV) interconnections. Two different technology platforms have been investigated: a BSI design for near-infrared (NIR) sensitive SiPMs and TSV interconnections for near- and vacuum-ultraviolet (NUV/VUV) sensitive detectors. For NIR applications, electrical characterization of ultra-thin (about 10μm) SiPM wafers with a metal reflector on the frontside has shown an improved photon detection efficiency (PDE) when operated in BSI configuration compared with non-thinned front-side illuminated (FSI) devices, allowing at the same time full high-segmentation access to the SiPM output from the front-side. Instead, for NUV/VUV applications, a FSI stacked approach is considered more suitable since the junction depth needs to be shallower. In this case, TSV interconnections using two different approaches (named Via-Mid and Via-Last) have been implemented allowing the placement of the contacts on the backside of the wafer.