材料科学
弧(几何)
复合材料
断裂(地质)
接口(物质)
机械工程
工程类
毛细管数
毛细管作用
作者
J.L. Galán Argumedo,Ton Riemslag,M. J. M. Hermans,Vera Popovich
标识
DOI:10.1016/j.msea.2025.148034
摘要
Wire arc additive manufacturing (WAAM) offers a novel approach to fabricate functionally graded components. By changing the wire consumable between layers, chemical grading can be used to obtain specific properties across a part’s volume. This is an interesting approach to design large metal components that achieve unconventional performance in demanding engineering applications, such as sulphide-resistant pressure vessels or sea ballast piping with extended lifetime. However, challenges derived from dissimilar material combinations draw the need to study the effect of compositional grading on the mechanical properties. This study focuses on the deformation and fracture toughness behaviour of WAAM-fabricated high-strength low-alloy (HSLA) and austenitic stainless (AS) steel bi-material specimens, particularly examining the diluted interface layer obtained during deposition. Tensile testing results indicate that the elastic modulus at the interface matches that of un-diluted AS steel (157 ±17 GPa) along the build direction. Fracture toughness showed a lower J IC (180 kJ∙m -2 ) when compared to the undiluted AS steel (459 ±69 kJ∙m -2 ) and HSLA steel (408 ±25 kJ∙m -2 ). Scanning electron microscopy and electron backscatter diffraction are used to establish a connection between the microstructure at the interface and the observed mechanical properties. It is concluded that deformation at the interface is in large controlled by the deformation-induced martensitic transformation of metastable austenite. These results underline the influence of chemical dilution on the deformation mechanisms and fracture behaviour of HSLA and AS steel bi-material parts, which needs to be accounted for in the design of parts composed by this bi-metal couple. • Depositing AS steel onto HSLA steel by WAAM creates a diluted interface layer. • There, plastic deformation is dominated by a TRIP-effect. • Fracture toughness at the interface layer is lower than the parent materials. • It’s resistance to crack propagation is capped by martensite and Type-II boundaries.
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