高电子迁移率晶体管
光电子学
可扩展性
薄脆饼
信号(编程语言)
材料科学
负载拉力
氮化镓
功率(物理)
大信号模型
电子工程
电气工程
计算机科学
工程类
晶体管
图层(电子)
物理
电压
纳米技术
CMOS芯片
数据库
放大器
程序设计语言
量子力学
作者
Ho‐Sang Kwon,Jonghun Jung,Dong‐Wook Kim
出处
期刊:The Journal of Korean Institute of Electromagnetic Engineering and Science
[Korean Institute of Electromagnetic Engineering and Science]
日期:2020-12-01
卷期号:31 (12): 1059-1068
标识
DOI:10.5515/kjkiees.2020.31.12.1059
摘要
In this study, a scalable GaN HEMT large-signal model for 140-W power devices is presented. The large-signal model of an 80-finger GaN HEMT includes eight unit device models in parallel, and the large-signal model of the unit device is based on the AMCAD–FET model. The unit device includes a 10-finger GaN HEMT, a gate pad, and a drain pad. Parameters for the unit GaN HEMT model were extracted using an IVCAD program of AMCAD and a Keysight PNA-X network analyzer. The unit GaN HEMT model was verified through on-wafer load-pull measurements, and the large-signal GaN HEMT model of the large-sized 80-finger device was verified through load-pull measurements of the packaged device.
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