材料科学
微电子机械系统
电容感应
薄脆饼
电容
表面微加工
体微机械加工
悬臂梁
倾斜感应器
光电子学
线性
石英
焊接
信号(编程语言)
蚀刻(微加工)
电极
电气工程
复合材料
制作
光学
工程类
医学
图层(电子)
计算机科学
替代医学
程序设计语言
光纤
化学
物理化学
病理
物理
作者
Jinxing Liang,Fusao Kohsaka,Takahiro Matsuo,Xuefeng Liu,Ken Kunitomo,T. Ueda
标识
DOI:10.1143/jjap.48.06fk10
摘要
In this paper, we report the research progress of a recently developed quartz micro-electro-mechanical system (MEMS)-based capacitive tilt sensor using bulk micromachining technology. The sensor, which is composed of a sensitive cantilever, proof mass and high-aspect-ratio vertical comb electrodes in wafer thickness, was fabricated using an anisotropic wet etching process on a 100-µm-thick z-cut quartz wafer. A ceramic package was designed for mounting the sensor and integrating the capacitance to a digital AD7746 circuit (Analog Devices). The sensor was mounted on the package using a flip chip method via a AuSn alloy solder. The dimensions of the integrated sensing system are 12 ×12 ×3.2 mm3 and the weight of the system is below 1 g. The measured typical sensor sensitivity is 632 fF/° when the applied voltage is 0.625 V. The peak-to-peak output signal drift is limited to 1 fF in 2 h. Good linearity was achieved in the range of ±1°. High-precision detection at 0.001°, which corresponds to micro-g acceleration, was also demonstrated.
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