CMOS芯片
消散
电子线路
MOSFET
超大规模集成
材料科学
速度饱和
数字电子学
饱和电流
电子工程
阈值电压
集成电路
电气工程
光电子学
晶体管
电压
工程类
物理
热力学
标识
DOI:10.1109/icspcom.2013.6719819
摘要
Aggressive technology scaling and an increasing demand of high performance VLSI circuits has resulted in higher current densities and increased power dissipation. A significant fraction of this power is converted to heat and an exponential rise in heat density is experienced. As a consequence, temperature measurement and control are critical tasks in many applications. Temperature variations often alter threshold voltage, carrier mobility and saturation velocity of MOSFET and thereby altering the performance of the CMOS circuits. This paper identifies the device parameters that characterize the variation of MOSFET current due to temperature fluctuations on 180nm CMOS technology. Further, the effect of temperature variation on performance of CMOS digital circuits and optimization of device parameters for temperature variation insensitive performance of the circuit is also presented.
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