十字线
薄脆饼
光学
平版印刷术
材料科学
临界尺寸
X射线光刻
弧(几何)
维数(图论)
垂直的
光电子学
抵抗
图层(电子)
物理
纳米技术
工程类
几何学
机械工程
数学
纯数学
作者
Bruno M. La Fontaine,Adam R. Pawloski,Alden Acheta,Yunfei Deng,Harry Levinson,Christopher Spence,Christian Chovino,Laurent Dieu,Eric Johnstone,Franklin D. Kalk
摘要
The impact of wafer and reticle anti-reflection coatings (ARCs) on the aerial image of ArF lithography scanners is measured using contrast curves and critical dimension (CD) analysis. The importance of a good ARC layer on the wafer appears to be greater than that of the reticle-ARC. In fact, for state-of-the-art lithography scanners, the influence of the reticle-ARC is practically undetectable. Numerical simulations are used to understand the relative contributions of the lens, the wafer and the reticle to the overall loss of contrast associated with non-optimized ARCs.
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