Vincent M. Donnelly,Daniel L. Flamm,D. E. Ibbotson
出处
期刊:Journal of vacuum science & technology [American Institute of Physics] 日期:1983-04-01卷期号:1 (2): 626-628被引量:35
标识
DOI:10.1116/1.572194
摘要
Plasma etching techniques for III-V compound semiconductors are reviewed, emphasizing design considerations in the choice of gases, discharge parameters, and substrate temperature. Mechanisms are proposed for anisotropic, isotropic, and crystallographic chemical etching. Applications of plasma etching in device fabrication are given.