Surface-mount component attachment for e-textiles

Integration of electronic components into textile structures is a key requirement for smart clothing applications, particularly those in which electronics must be distributed over the body surface. Scalable manufacturing techniques for textile-integration of components are a key need in the wearables industry. Here, we introduce a novel technique for assembling surface-mount "fabric PCBs" using stitched traces and reflow soldering techniques. We present an initial evaluation of the durability of this method comparing three variables of manufacture. Results show that all configurations are sufficiently durable for low-intensity wear, and for high-intensity wear larger components and traces and perpendicular trace layout improve durability.