表面贴装技术
耐久性
织物
焊接
电子元件
数码产品
服装
可扩展性
可穿戴计算机
计算机科学
可穿戴技术
钥匙(锁)
组分(热力学)
机械工程
材料科学
嵌入式系统
工程类
复合材料
电气工程
物理
考古
热力学
历史
数据库
计算机安全
作者
Mary Ellen Berglund,Julia Duvall,Cory Simon,Lucy E. Dunne
标识
DOI:10.1145/2802083.2808413
摘要
Integration of electronic components into textile structures is a key requirement for smart clothing applications, particularly those in which electronics must be distributed over the body surface. Scalable manufacturing techniques for textile-integration of components are a key need in the wearables industry. Here, we introduce a novel technique for assembling surface-mount "fabric PCBs" using stitched traces and reflow soldering techniques. We present an initial evaluation of the durability of this method comparing three variables of manufacture. Results show that all configurations are sufficiently durable for low-intensity wear, and for high-intensity wear larger components and traces and perpendicular trace layout improve durability.
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