Effect on plasma treatment on adhesive bonding strength

The development of electronic components is rapidly progressing due to the recent growth of electronic technology. As a representative example, wearable electronic devices are being widely studied as next-generation electronic devices. Next-generation wearable electronic devices require the development of flexible electronic devices and sophisticated components. Besides, it requires high adhesion between the flexible substrate and electrical components such as multilayer flexible printed circuit boards. Various adhesion processes have been studied to improve adhesion. As a method for increasing the adhesion, the most important factor is to improve the adhesion of the adhesive, but there is additionally a method of improving the adhesion by changing the surface area of the medium. Plasma treatment in electronics, developed for application to multi-layer flexible printed circuit boards for next-generation flexible mobile electronics, can assist to strongly combine different materials by changing the surface area to form a stronger bonding strength between the medium and the adhesive. We conducted on how the adhesion strength is improved depending on the presence or absence of plasma treatment on the medium. Also, as the heat conduction behavior was enhanced due to the miniaturization of electronic components, the heat resistance of the adhesive is also tested. We find that the adhesive strength decreases as the temperature increases, which is explained in this study.