Glass‐Ceramic Substrates for Electronics Packaging

ABSTRACT The rapid advancement of wireless communication technologies, from 5G to 6G, has necessitated significant improvements in materials used for electronic packaging. Glass‐ceramics have long been promising candidates due to their unique combination of low dielectric loss, high thermal stability, and excellent mechanical properties. This review explores the potential compositional systems of glass‐ceramics in electronic packaging substrates, emphasizing their performance in high‐frequency applications. An analysis of their fabrication techniques and material properties is discussed. Comparisons with traditional polymer and ceramic substrates highlight the advantages of glass‐ceramics, including enhanced signal integrity and thermal management. Challenges in processing and material optimization, as well as emerging trends such as glass‐polymer composites and advanced manufacturing techniques, are discussed. This review provides a forward‐looking perspective on the role of glass‐ceramics in enabling the next generation of electronic devices.