胶粘剂
材料科学
导电体
电阻率和电导率
导电的
环氧树脂
烧结
导电油墨
复合材料
电导率
电极
填料(材料)
薄板电阻
电气工程
物理化学
化学
工程类
图层(电子)
标识
DOI:10.1016/j.microrel.2023.114917
摘要
Printable electrically conductive adhesive with high electrical conductivity and good mechanical properties has a broad application prospect in electronic devices. In order to explore the preparation method of high-purity nanometal conductive filler for conductive adhesive, silver nanopowders were prepared by DC arc plasma method. The silver nanopowders present a spherical structure and the average particle size is 55 nm. In this paper, a high performance electrically conductive adhesive (ECA) was prepared. This ECA was fabricated by mixing silver nanopowders with epoxy resin and screen-printed to a required shape. It was found that the ECA can be solidified through a low temperature sintering method in the air at 150 °C for 10 min. The electrical and mechanical properties of above ECA were investigated and characterized. The ECA filled with 75 % silver nanopowders exhibits excellent performances, including high electrical conductivity (9.8 × 10−3 Ω·cm) and high bonding strength (8.3 MPa). Based on the performance characteristics, the ECA applications in flexible printed electrodes and interconnecting materials are demonstrated.
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