High-Temperature Electronics Enabled by Copper–Platinum and Polymer-Derived Silicon Oxycarbide through Additive Manufacturing

High-temperature capable materials are necessary for emerging extreme environment applications. Considering that a foreboding challenge with contemporary materials technology is their stability and reliability under extreme conditions, this calls for advanced functional materials with electrical conductivity and oxidation resistance under high temperatures. Herein, we demonstrate the stoichiometric tailoring of copper bimetallic conductors coupled with additive manufacturing and pyrolysis of preceramic polymer substrates, enabling high-temperature printed sensor electronics. The resulting bimetallic alloy provides electrical stability at 1000 °C for a duration of 25 h, while incorporation of preceramic polymer-derived silicon oxycarbide as the piezoresistive element enables pressure sensing at 1000 °C with a sensitivity of 0.35 kPa–1.