Electrodeposited Superconducting Re on Flexible Substrates Using Aerosol Jet Printed Metal Seed Layers

Electrodeposition of superconducting Re on aerosol jet printed (AJP) metal seed layers on a flexible substrate is investigated. Silver and gold seed layers are printed using the “Nanojet” aerosol jet printer on Kapton films. Thermogravimetric analysis, stylus profilometer, and three-point bend test are performed to characterize the AJP metal seed layer on such flexible substrates. Electrodeposition of Re is successfully carried out on the Au seed layer and is characterized using various techniques, such as X-ray fluorescence spectroscopy, focused ion beam, scanning electron microscope, energy dispersive spectroscopy, X-ray diffraction, and four-point probe electrical measurements at cryogenic temperatures. The superconductivity of such a flexible Re stack is confirmed with an elevated critical temperature ( T_c ) of 6 K.