材料科学
微观结构
动态再结晶
合金
冶金
再结晶(地质)
变形(气象学)
黄铜
应变率
热加工
透射电子显微镜
铜
复合材料
生物
古生物学
纳米技术
作者
Deye Xu,Meng Zhou,Yi Zhang,Shunlong Tang,Zhiyang Zhang,Yong Liu,Baohong Tian,Xu Li,Yanlin Jia,Alex A. Volinsky,De Li,Qiujie Liu
标识
DOI:10.1016/j.matchar.2022.112559
摘要
The effects of Y addition on the microstructure evolution in the Cu-Sn-Ni-Zn-Ti alloys during hot deformation were investigated. The hot deformation experiments were carried out using a Gleeble-1500 simulator and the Cu-Sn-Ni-Zn-Ti and Cu-Sn-Ni-Zn-Ti-Y alloys deformed at 550–950 °C with 0.001–10 s−1 strain rate. The constitutive equations were constructed, and the hot deformation activation energy of the two alloys was calculated. Based on the true stress-strain curves and electron backscattered diffraction image analysis, it was concluded that the addition of 0.1 wt% rare earth Y element can promote dynamic recrystallization. The pole figures demonstrated the texture change from {011}〈112〉 Brass texture and {001}〈100〉 Cube texture to {111}〈211〉 R texture after Y addition. The microstructure and precipitates of the Cu-Sn-Ni-Zn-Ti alloy were analyzed by transmission electron microscopy, and Cu4Ti precipitates were present in the alloy. The continuous dynamic recrystallization and the discontinuous dynamic recrystallization were the two main recrystallization mechanisms of the Cu-Sn-Ni-Zn-Ti alloy.
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