Whole martensitic transformation process in Fe–Mn–Si–Cr shape memory alloy by improved characterization of volume resistivity

形状记忆合金 材料科学 无扩散变换 电阻率和电导率 奥氏体 形状记忆合金* 合金 体积热力学 变形(气象学) 马氏体 应变率 冶金 复合材料 微观结构 热力学 计算机科学 电气工程 工程类 物理 算法
作者
Qian Sun,Bo Cao,Takeshi Iwamoto
出处
期刊:Journal of materials research and technology [Elsevier BV]
卷期号:25: 2061-2074 被引量:9
标识
DOI:10.1016/j.jmrt.2023.06.095
摘要

Since Fe–Mn–Si–Cr shape memory alloy (Fe-SMA) has been discovered, an improvement of the shape memory effect (SME) is challenged. Numerous attempts have been made thus far to improve SME. To effectively control such performance, it becomes imperative to comprehend the real-time behavior of the stress-induced martensitic transformation (SIMT), which is strongly related to SME, during deformation. In the past, the measurement of volume resistivity has been proposed and applied to capture the forward SIMT behavior during the tensile loading process at various strain rate. However, it is quite hard to find investigations of the reverse martensitic transformation after the loading, which is more essential for understanding SME. Therefore, a comprehensive evaluation of the whole SIMT process including the loading process at various strain rate is strongly required. In this study, an improved measurement of volume resistivity is established by introducing both the four-probe and active-dummy techniques with a development of a diameter measurement at high temperature. Then, the volume resistivity of Fe-SMA is measured during the whole deformation including loading under tension at various strain rate, unloading, and heating processes. Besides, the microstructures of Fe-SMA after unloading and heating processes are observed, respectively. Finally, the real-time whole martensitic transformation in Fe-SMA is first investigated with the novel optimization method. The negative strain rate of change in volume resistivity during whole processes can be found. More amount of austenite can be obtained at lower strain rate, resulting in a larger SME.
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