钝化
铜
苯并三唑
纳米颗粒
氧化剂
材料科学
降水
化学工程
腐蚀
无机化学
基质(水族馆)
冶金
化学
纳米技术
图层(电子)
有机化学
气象学
工程类
地质学
物理
海洋学
作者
Yan Li,Maogang Gong,Karpagavalli Ramji,Yuzhuo Li
摘要
The present study deals with the formation and characterization of Cu−benzotriazole (BTA) nanoparticles, which are relevant to copper surface corrosion and passivation. More specifically, we demonstrated that under oxidizing conditions, the cupric ions diffused out of the copper substrate surface can induce the formation of Cu−BTA nanoparticles. These nanoparticles can subsequently precipitate back to the copper surface or form a cross-link with the copper species on the original surface. Such a precipitation path for the formation of a copper-passivating film may supplement or compete with the direct growth mechanism in which the passivating agent interacts with copper species directly before they diffuse out of the substrate surface.
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