薄脆饼
晶圆级封装
静电放电
变压器
晶圆规模集成
晶片测试
电子工程
频域
计算机科学
电压
工程类
材料科学
电气工程
计算机视觉
作者
B.C.S. Chou,Timothy J. Maloney,Tze Wee Chen
出处
期刊:Electrical Overstress/Electrostatic Discharge Symposium
日期:2008-09-01
卷期号:: 115-124
被引量:13
摘要
Charged Device Model (CDM) ESD testing is demonstrated on wafer level. With a custom probe-mounted printed-circuit board and a high-frequency transformer that captures fast CDM pulses, wafer-level CDM (WCDM) pulses are applied and monitored repeatably. Modeling of CDM and WCDM in the time and frequency domain illustrates the dominant effects, and shows that WCDM can reproduce all the major phenomena of package-level CDM testing.
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