铜
硫化铜
硫黄
硫化物
硫酸
无机化学
硫化氢
化学
电化学
X射线光电子能谱
二氧化硫
化学工程
有机化学
电极
物理化学
工程类
作者
S.N. Chawla,BI Rickett,JH Payer
摘要
Films formed on copper exposed to various sulfur-bearing environments were analyzed by XPS and electrochemical reduction to study the formation of copper sulfide. The S-2p photoelectron band showed the presence of copper sulfide in the film in addition to oxysulfur species. Coulometric reduction analysis of the film suggested that the sulfide was nonstoichiometric. The formation of copper sulfide was also noted on copper immersed in “sulfurous” acid and in sulfuric acid. The properties of the sulfide that formed reductively on copper from these oxysulfur environments were compared with those of copper sulfide that formed from a moist hydrogen sulfide environment. Formation of copper sulfide from the oxysulfur environments showed that sulfur could participate as a reducible species in the film-forming corrosion reactions.
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