Thermal Simulation Analysis of High Power LED with Varied Heat Sink Fin Design

In this paper, the heat distribution for single chip high power LED package attached with varied heat sink fin shapes were analyzed through simulation. The main focus of this study was to scrutinize the fluctuation of junction temperature with different shapes of heat sink fin designs. The simulation was done using Ansys version 11. The single chip LED was loaded with input power of 0.5 W and 1 W . Simulation was done at ambient temperature of 25°C under three convection coefficient of 5, 10 and 15 W/m 2.o C respectively. The obtained results showed that the LED package with pyramid pin fin heat sink has demonstrated a better thermal performance compared to the LED package with cylindrical pin fin heat sink.