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Evolution of Atomic-Level Interfacial Fracture Mechanics in Magnesium–Zinc Compounds Used for Bioresorbable Vascular Stents

材料科学 金属间化合物 复合材料 断裂韧性 应变能释放率 极限抗拉强度 分层(地质) 断裂力学 图层(电子) 冶金 俯冲 构造学 生物 古生物学 合金
作者
Zhen Zhou,Chaoyue Ji,Dongyang Hou,Shunyong Jiang,Yuhang Ouyang,Fang Dong,Sheng Liu
出处
期刊:Materials [Multidisciplinary Digital Publishing Institute]
卷期号:17 (19): 4734-4734
标识
DOI:10.3390/ma17194734
摘要

Bioresorbable magnesium-metal vascular stents are gaining popularity due to their biodegradable nature and good biological and mechanical properties. They are also suitable candidate materials for biodegradable stents. Due to the rapid degradation rate of Mg metal vascular scaffolds, a Mg/Zn bilayer composite was formed by a number of means, such as magnetron sputtering and physical vapor deposition, thus delaying the degradation time of the Mg metal vascular scaffolds while providing good radial support for the stenotic vessels. However, the interlaminar compounds at the metal interface have an essential impact on the mechanical properties of the bi-material interface, especially the cracking and delamination of the Mg matrix Zn coating vascular stent in the radially expanded process layer. Intermetallic compounds (IMCs) are commonly found in dual-layer composites, such as Mg/Zn composites and multi-layer structures. They are frequently overlooked in simulations aiming to predict mechanical properties. This paper analyses the interfacial failure processes and evolutionary mechanisms of interfacial fracture mechanics of a Mg/Zn interface with an intermetallic compound layer between coated Zn and Mg matrix metallic vascular stents. The simulation results show that the fracture mode in the Mg/Zn interface with an intermetallic compound involves typical ductile fracture under static tensile conditions. The dislocation line defects mainly occur on the side of the Mg, which induces the Mg/Zn interfacial crack to expand along the interface into the pure Mg. The stress intensity factor and the critical strain energy release rate decrease as the intermetallic compound layer’s thickness gradually increases, indicating that the intensity of stress and the force of the crack extending and expanding along the crack tip are weakened. The presence of intermetallic compounds at the interface can significantly strengthen the mechanical properties of the material interface and alleviate the crack propagation between the interfaces.
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