Detachable fiber connectivity solution for co-packaged optics and advanced semiconductor packaging integration (Conference Presentation)

The increasing demands of advanced computing and data center applications necessitate high-speed, low-latency, and low-power data transfer, making optical interconnects crucial. Fiber to photonics integrated circuits (PIC) interconnects offer a superior solution, but widespread deployment is hindered by the complexities of fiber-to-PIC packaging, especially with GPUs and advanced ASIC packages. Current fiber packaging solutions face challenges with reliability and manufacturability in dense, large fiber count connectivity and advanced 3D packaging requirements. We introduce a detachable fiber connectivity solution optimized for co-package optics and 3D packaging integration. Our technology uses wafer-level processes to create self-aligning optical coupling elements, enabling large assembly tolerances for passive fiber attachment and detachable mechanical connectivity. Detachable connectivity allows for reworkable and reliable packaging of large fiber count, post reflow attach, thin form factor and multiple testable points during different packaging steps. This presentation details our solution's technological advancements and compatibility with high-volume manufacturing