Development of a Microheater with a Large Heating Area and Low Thermal Stress in the Heating Area

In this paper, a microheater that can absorb thermal stress and has a large heating area is demonstrated by optimizing the structure and process of the microheater. Four symmetrically distributed elongated support beam structures were machined around the microheater via deep silicon etching. This design efficiently mitigates the deformation of the heated region caused by thermal expansion and enhances the structural stability of the microheater. The updated microheater no longer converts the work area into a thin film; instead, it creates a stable heating platform that can uniformly heat a work area measuring 10 × 10 mm2. The microheater is verified to have high temperature uniformity and structural stability in finite element simulation. Finally, thorough investigations of electrical–thermal–structural characterization were conducted. The test findings show that the new microheater can achieve 350 °C with a power consumption of 6 W and a thermal reaction time of 22 s. A scan of its whole plane reveals that the surface of the working area of the new microheater is flat and does not distort in response to variations in temperature, offering good structural stability.