声子
热导率
材料科学
表面声子
热的
凝聚态物理
硅
Atom(片上系统)
曲面(拓扑)
多孔硅
芯(光纤)
多孔性
热传导
化学物理
热分解
热阻
光电子学
分子物理学
分子动力学
分子振动
电导率
热流密度
作者
Peng Bi,Yakun Wan,Yong Yi,Songhu Bi
出处
期刊:Physical review
[American Physical Society]
日期:2025-10-07
卷期号:112 (15)
被引量:1
摘要
One of the core strategies for reducing the thermal conductivity of materials lies in effectively suppressing phonon transport. This study demonstrates that the thermal conductivity of silicon-based triply periodic minimal surface (TPMS) structures can be efficiently regulated through precise surface engineering. Specifically, the proportion of surface atoms and interface density in TPMS structures are controllable by adjusting the threshold parameter $c$ (a key geometric parameter that modulates the porosity of TPMS frameworks) and size parameter. Molecular dynamics simulation results indicate that TPMS structures reduce thermal conductivity, a phenomenon attributed to enhanced phonon-surface scattering. Surface phonons induce unique vibrational behaviors, including high-frequency localized modes, low-frequency phonon softening, and prominent boson-peak-like anomalies, and phonon participation ratio analysis confirms a direct correlation between strong phonon localization and surface atom density. Moreover, spectral thermal conductivity decomposition results further verify that surface phonons contribute negligibly to thermal conduction, while the core regions (with intact lattice) dominate heat transfer. These findings confirm that interaction between surface phonons and bulk phonons is the fundamental mechanism for thermal transport regulation in TPMS structures, providing a strategic pathway for designing functional thermal materials with on-demand customized thermal conductivity.
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