Lv53
850 积分 2024-12-12 加入
Advanced Fanout Packaging Technology for Hybrid Substrate Integration
20天前
已完结
Fan-Out Embedded Bridge with TSV(FO-EB-T) Package Characterization and Evaluation
1个月前
已完结
AMD InstinctTM MI250X Accelerator enabled by Elevated Fanout Bridge Advanced Packaging Architecture
1个月前
已完结
11.1 AMD InstinctTM MI300 Series Modular Chiplet Package – HPC and AI Accelerator for Exa-Class Systems
1个月前
已完结
3D Packaging for Heterogeneous Integration
1个月前
已完结
3.5D Advanced Packaging Enabling Heterogenous Integration of HPC and AI Accelerators
1个月前
已完结
Roadmap and Challenges on the Next Generation of Thermal Interface Material for High Warpage Heterogonies Package
1个月前
已完结
Prepreg-based FCBGA for Advanced Packaging Substrate
3个月前
已完结
Efficient Backside Power Delivery for High-Performance Computing Systems
3个月前
已完结
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