Lv43
590 积分 2024-12-12 加入
Roadmap and Challenges on the Next Generation of Thermal Interface Material for High Warpage Heterogonies Package
2天前
已完结
Prepreg-based FCBGA for Advanced Packaging Substrate
1个月前
已完结
Efficient Backside Power Delivery for High-Performance Computing Systems
1个月前
已完结
Back-side Design Methodology for Power Delivery Network and Clock Routing
1个月前
已完结
Bonding Properties of Package-on-Package Stack Interconnection Using by 150 ㎛ Height Copper Posts
2个月前
已完结
Theory and implementation of sub-model method in finite element analysis
2个月前
已完结
High Speed SerDes Design on Flip Chip Package Substrate
3个月前
已完结
2023 ICEPT COLLECTION
3个月前
已完结
High-Speed TSV-Based Channel Modeling and Design
3个月前
已完结
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