Trends in packaging and high density interconnection
作者
Eric Beyne,R. Mertens
标识
DOI：10.1109/icm.2000.884794
摘要
In this paper, some of the main trends in packaging and interconnection technology for microelectronic devices are reviewed. Particular attention is given to the impact of the evolution of microelectronic technology on the requirements for electronic packaging.
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