Abrasive Materials for Semiconductor Chemical Mechanical Polishing: Composition, Performance, and Emerging Trends

has unique chemical activity and high selectivity, which is advantageous in the shallow trench isolation (STI) process. This review analyzes the current challenges (defect control, slurry stability, environmental constraints) and emerging trends (composite abrasive design, sustainable manufacturing). It provides technical insights for the development of high-precision and high-efficiency CMP processes in semiconductor manufacturing.