散热片
计算机冷却
纳米流体
工作液
水冷
主动冷却
电子设备冷却
过热(电)
传热
被动冷却
机械工程
热管
材料科学
空气冷却
核工程
工艺工程
工程类
机械
电子设备和系统的热管理
电气工程
物理
作者
Muhammad Arif Harun,Nor Azwadi Che Sidik
出处
期刊:Journal of Advanced Research in Fluid Mechanics and Thermal Sciences
日期:2020-12-10
卷期号:78 (2): 98-113
被引量:12
标识
DOI:10.37934/arfmts.78.2.98113
摘要
Electronic devices are becoming more efficient while getting a smaller size and compact design thus increase heat generation significantly. High heat generation from high technology electronic devices are needed to be cool down or control its temperature to prevent overheating problems. Due to the high cooling performance of liquid cooling, the electronic cooling system is shifting from an air-cooling system to a liquid cooling system. In the past few decades, numerous methods proposed by researchers for the central process unit (CPU) cooling using the liquid system either active cooling or passive cooling system. Other than physical configuration such as heat sink design, different configurations of working fluids are widely been studied by most of the researchers. Different working fluids have different heat transfer performance. Furthermore, a recent study has come out more interesting finding using nanofluid which can enhance heat transfer performance of liquid cooling. Nanofluid is a working fluid that has nanoparticles disperse in the base fluid which can increase the thermal properties of the based fluid. In this paper, comprehensive literature on the type of working fluid used in the respective system and methods of liquid cooling system for CPU including its cooling performance. Furthermore, this review paper discussed the different configuration of the liquid block and also the working fluid that had been used in the CPU cooling system.
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