Failure Mechanism and Failure Analysis of ICs in Sip Module

Failure analysis(FA) of ICs in Si P(System-in-Package) module was often carried out blindly, for the shortage of failure analysis techniques. A failure analysis method combined with the fault tree analysis was introduced, and by taking the failure cases of IR PMOS, failure mechanism of ICs familiar in the Si P module were discussed, including electrical stress, thermal stress, mechanical damage and environmental stress. From the perspective of design and implementation, improvement measures to reduce the failure rate were proposed in the end.