Temperature Dependent Electrical Properties of N-Type 4H-SiC Substrates

High-quality, low resistivity n-type (nitrogen-doped) single crystal 4H-SiC wafers are needed to grow high-quality epitaxial SiC layers used for the active blocking layers of high-voltage power devices. The resistance of the substrate constitutes a portion of the device resistance for vertical devices, and therefore the SiC substrate properties must be fully characterized. In this study we report the 4H-SiC substrate electrical properties as a function of temperature measured using van der Pauw structures to measure resistivity from 4-point measurements, and carrier concentration and mobility from Hall effect measurements. We find that the SiC substrate resistivity has a minimum around 425K for typical substrate doping levels, due to a competition between the decreasing mobility and increasing carrier concentration with increasing temperature. The measured energy levels of the N donor (hexagonal / cubic sites) are extracted for a 5.8×10 18 cm -3 N-doped substrate, and found to be 15 meV and 105 meV, respectively.