Eclipse Dynamic Probe Card: A Novel Approach for Wafer-Level Photonic Testing with Automated Fiber Array Unit Alignment

The increasing integration of optical and electronic components has led to the widespread adoption of Photonic Integrated Circuits (PICs). As PIC complexity grows, wafer-level testing becomes a critical challenge, requiring both electrical and optical characterization with nanometric alignment precision. This paper presents Eclipse Dynamic, an innovative probe card integrating both electrical probes and an embedded Fiber Array Unit (FAU) actuated by piezoelectric elements within the Probe Head, enabling automated, high-precision optical alignment without external positioning equipment. A preliminary feasibility study is conducted to characterize the FAU’s dynamic alignment capabilities and to demonstrate the system’s ability to achieve nanometric alignment accuracy.