环氧树脂
材料科学
电介质
三氟甲基
复合材料
热稳定性
玻璃化转变
抗弯强度
吸水率
高分子化学
有机化学
聚合物
化学
烷基
光电子学
作者
Yurong Zhang,Haidan Lin,Kai Dong,Shasha Tang,Chengji Zhao
出处
期刊:Polymers
[MDPI AG]
日期:2023-06-28
卷期号:15 (13): 2853-2853
被引量:1
标识
DOI:10.3390/polym15132853
摘要
A series of epoxy resins containing various trifluoromethyl groups were synthesized and thermally cured with diaminodiphenylmethane (DDM) and aminophenyl sulfone (DDS). All epoxy resins exhibited excellent thermal stability with the glass transition temperatures of above 128 °C and 5% weight loss temperatures of above 300 °C. DDS-cured epoxy resins possessed higher thermal stability than that of DDM-cured epoxy resins, while DDM-cured epoxy resins showed better mechanical, dielectric, and hydrophobic properties. Additionally, DDM-cured epoxy resins with different locations and numbers of trifluoromethyl groups showed flexural strength in the range of 95.55~152.36 MPa, flexural modulus in the range of 1.71~2.65 GPa, dielectric constant in the range of 2.55~3.05, and water absorption in the range of 0.49~0.95%. These results indicate that the incorporation of trifluoromethyl pendant groups into epoxy resins can be a valid strategy to improve the dielectric and hydrophobic performance.
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