Technics and Optimization of Wafer Dicing

This paper aims to study wafer dicing process of dicing saw,analyzes the quality defects and dicing quality evaluation matrix,described the many factors that affect the quality of dicing,such as dicing blade,mounting tape,dicing mode,cooling water additive and the selection of dicing parameters,the quality of the optimization of the above five aspects to optimize the process,meanwhile proposed a new dicing process of combination dicing saw and micro-water guided laser dicing.