化学气相沉积
材料科学
原子层沉积
薄膜
纳米技术
燃烧化学气相沉积
过渡金属
沉积(地质)
基质(水族馆)
化学工程
碳膜
催化作用
化学
有机化学
海洋学
地质学
工程类
古生物学
生物
沉积物
作者
Gyu Hyeon Park,Kornelius Nielsch,Andy Thomas
标识
DOI:10.1002/admi.201800688
摘要
Abstract Ultrathin 2D transition metal dichalcogenide (TMD) thin films have attracted much attention due to their very good electrical, optical, and electrochemical properties. Chemical vapor deposition (CVD) and atomic layer deposition (ALD), which is in some regards an enhanced version of CVD, are techniques that can provide exceptionally conformal large‐area coatings, even for complex surface geometries. Besides, these techniques include the transport of one or more precursor chemicals in the gas phase onto a substrate. Subsequently, a chemical reaction occurs, resulting in the deposition of a film of a solid material on the substrate. One of the advantageous aspects of chemical deposition methods, such as CVD and ALD, is the growth of thin films onto a variety of substrates as well as 3D structures. Because of their chemical approach, these techniques are well suited to synthesizing 2D materials (2DMs) with a low defect concentration. Furthermore, the scalability would allow industrial application, as opposed to, e.g., micromechanical cleavage. Here, the recent progress in 2D TMD thin films is reviewed and the current applications of these materials fabricated by CVD and ALD are surveyed.
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