Film Materials Based on Polyethylene with Silicon Nanoparticles and Silicon Carbide

In this research and development, the extrusion method was used to obtain polyethylene films containing 0.1–1.5 wt % n-SiC and n-Si nanoparticles obtained by the plasma chemical method. Using the spectral analysis method, it was found that the films obtained absorb UV radiation in the range of 200–400 nm, which is harmful to organic matter. The method of X-ray structural analysis was used to determine the average size of particles and the quality of their dispersion in the films. Differential scanning calorimetry and physicomechanical tests have shown that nanoparticles do not affect the formation of the internal structure of the polyethylene (PE) matrix. The degree of crystallinity, melting point, and crystallization point remain unchanged. The properties of the surface of the films, studied by tribological and triboelectric methods and determination of the contact angle, remain constant and do not differ from the properties of PE films with a nanoparticle content from 0.1 to 1%. At 1.5% nSiC content, a change in the surface microrelief is diagnosed, leading to a small increase in the film friction coefficient. The polyethylene films filled with n-SiC and n-Si obtained in this work are recommended for use as UV protective coatings for various purposes.